Advanced performance for Φ300 mm dicing Φ300 mm    Facing dual spindle    DBG Enhanced dicing throughput The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...

Flagship model for Φ300 mm wafers with high process extensibility Φ300 mm Facing dual spindle DBG Compatible with both frame and two-way*(frame/wafer) transferring Various ...

A space-saving solution for Φ300 mm dicing Φ300 mm Facing dual spindle Space-saving layout DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type ...