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DAD3220
Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness
Φ150 mm
Single spindle
Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing ...
DAD323
World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components
Φ150 mm
Single spindle
Diversified Processes
The DAD323 is a ...
DAD3230
Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification
Single-axis ...
DAD3430
Φ6-inch Compact Dicing Saw Which Achieves High-Precision, High-Quality Processing
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified ...
DFD6240
Among the world’s smallest fully automatic dicing saws
Φ200 mm Single spindle
Factory-friendly design
By optimizing the frame structure and handling section layout, the ...
DAD3240
Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces
Φ200 mm
Single spindle
High processability
Adoption of a 1.8 kW high-output spindle enables the processing ...
DFD6341
Offering improved productivity of fully automatic dual spindle dicing saws by introducing measures to increase throughput with proven records in the field
Φ200 mm Facing dual ...
DAD3350
Flexibility for diverse processing needs
Φ200 mm
Single spindle
Supports a wide range of applications
DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...
DAD3650
Ultra compact dual-spindle automatic dicing saw
Φ200 mm
Facing dual spindle
Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness ...
DAD3360
Φ300 mm manual dicer to meet a variety of needs
Φ300 mm
Single spindle
Exceptional processing flexibility
While offering an even more compact footprint than the existing ...
DAD3660
Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm
Facing dual spindle
Package Singulation
Support for workpiece sizes up to 360 × 360 mm
By selecting a ...
DFD6450
Fully automatic dicing saw with parallel dual spindles
Φ200 mm
Parallel dual spindle
Package Singulation
A parallel dual design unique to DISCO
Featuring parallel dual-spindles, ...
DFD6362
Dicing saw for improved productivity with Φ300 mm wafers
Φ300 mm Facing dual spindle
Realizes further productivity improvement with various new functions
DFD6362 offers a ...
DFD6560
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized ...
DFD6760
High end dicing saw for Φ300 mm wafers
Φ300 mm
Facing dual spindle
Fully automatic dicing saw with dual chuck tables
DFD6760 is a high end model which has further enhanced ...
DAL7020
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
DFL7020
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
DFL7161
High-quality, high-throughput standard laser grooving model
Φ300 mm
Ablation
- DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide ...
DFL7160
Supports various applications, including full cut and DAF cut
Φ300 mm
Ablation
- DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...
DFL7341
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
Φ200 mm Stealth Dicing™ SDBG SDTT
- DFL7341 is a fully automatic laser saw for Φ8-inch ...