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B1A Series
Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
Metal bond Applications: Electronics components, Optical devices, Various types of ...
ZP07 Series
High grade processing is possible with an electroplated porous structure blade
The ZP07 series realizes high-grade processing of hard ...
The ZP07 series realizes high-grade processing of hard ...
TM11 Series
Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
CO 2 Injector
High quality processing through direct link to dicing saw
Workpiece charging significantly reduced
The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
VT07/12 Series
Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
GF13 Series
GRINDING WHEELS
Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...
•Supports SDBG ...
DP08 Series
Chemical-free stress relief dry polishing wheel|
In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
Gettering DP
Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
DWR1720
Deionized Water Recycling Unit
A super-compact deionized water recycling unit for advanced environmental performance
• Integrates deionized water ...
FM-2246 / 2248 /2243
You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production.
This manual wafer mounter series supports three different sizes of ...
FM-6648 / 6643
This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
FM-3343
This wafer mounter is ideal for diversified tape application and lamination conditions.
This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
FM-903S
FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work.
Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...
TEX-218G
TEX-218G for up to GR-8
The TEX series is adopted air cylinder for expansion stage operation. It makes
equipment component become simple and realized easy maintenance.
EX-300
EX Series
Model:
EX-300 for Gr-12
The EX series is an adopted motor drive for expansion stage operation.
Expansion stroke and expansion speed can be controlled numerically.
And film auto-cut function is equipped ...
UVC-300
Model: UVC-300A for up to 12”
UV-LED models which have a long life and low running cost are
cassette to cassette fully automatic system and 200mm (8”) manual
and 300mm (12”)
UVC-408 for 8”
High- pressure Mercury lamp models which have perfect UV curing
performances is 200mm (8”) manual and 300mm (12”) manual
system.
UVB-608i for up to 8"
Black-light type UVB-608i
UVB-608i is adopted black-light fluorescent lamp and designed minimal specification for
exceptional cost-performance value.
ICROS™ Tape
“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...
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