The most cost-efficient diced-wafer inspection system on the market. With a high-speed and high-precision 2D vision scanning system, the PHIXEL WIF guarantees exceptional throughput without compromising inspection quality and accuracy. Moreover, the Advanced Defect Classification (ADC) by hybrid analysis functionality of this inspection system will enhance manufacturing efficiency and competitiveness.

PHIXEL WIF offers inspection after wafer dicing to detect surface defects or inspection after saw singulation of molded package (QFN/DFN) to detect package and marking defects.