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Ultrasonic-wave dicing unit
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Realizes high quality and high speed processing of difficult-to-cut materials
Ultrasonic-wave pulses promote active self sharpening of the blade to
ensure high quality and high speed processing of difficult to- cut materials such as SiC and glass.
Ultrasonic-wave pulses promote active self sharpening of the blade to
ensure high quality and high speed processing of difficult to- cut materials such as SiC and glass.
Targets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing quality and high speed dicing of difficult-to-cut materials as typified by SiC (silicon carbide), glass and alumina ceramics.
Features of ultrasonic-wave processing
Transmitting ultrasonic-wave oscillations to the blade improves water circulation at the processing point (elimination of clogging caused by the cutting dust discharge effect and cooling of the processing point) and promotes self-sharpening of the blade (elimination of blade glazing). Thus, normal blade condition canbe maintained and process load can be reduced making highly efficient dicing possible.
Head Office
- Paseo 4B, Paseo de Sta. Rosa, Greenfield City, Sta. Rosa, Laguna Philippines 4026
- +63-(49)-5012436
- +63 908 887 4217
- +63 998 961 9440
- [email protected]
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