Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance
The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
High yield and high throughput separation of small die processed with Stealth Dicing™
Φ200 mm
SDTT
Reliable separation of small die wafers
The DDS2010 offers an integrated ...
Die separator for high-precision DAF separation
Φ300 mm
SDBG
SDTT
Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach ...
Among the world’s smallest fully automatic dicing saws
Φ200 mm Single spindle
Factory-friendly design
By optimizing the frame structure and handling section layout, the ...
Offering improved productivity of fully automatic dual spindle dicing saws by introducing measures to increase throughput with proven records in the field
Φ200 mm Facing dual ...
Dicing saw for improved productivity with Φ300 mm wafers
Φ300 mm Facing dual spindle
Realizes further productivity improvement with various new functions
DFD6362 offers a ...
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized ...
High end dicing saw for Φ300 mm wafers
Φ300 mm
Facing dual spindle
Fully automatic dicing saw with dual chuck tables
DFD6760 is a high end model which has further enhanced ...
Supports small volume grinding with high precisio
Φ200 mm
1 axis, 2 chuck tables
Stable, high-precision wafer processing
With the integration of devices, wafer manufacturing ...
Supports advancements for thinner wafers
Φ200 mm
2 axes, 3 chuck tables
Wafer Thinning
Thin grinding (<100 µm)
Advanced handling systems and design features facilitate high yield ...
Supports advancements for thinner and larger wafers
Φ300 mm
2 axes, 3 chuck tables
DBG
Wafer Thinning
Inherited grinding specifications with an established reputation
DFG8560 is ...
Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...