Product Filter
Results 81 - 100 of 110
Disco-DFD6363
Flagship model for Φ300 mm wafers with high process extensibility
Φ300 mm
Facing dual spindle
DBG
Compatible with both frame and two-way*(frame/wafer) transferring
Various ...
GF01 SERIES
Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
Super Bubbler Wac
Advanced resistivity control technology eliminates electrostatic charge in high-purity water.
Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...
Disco-DFD6561
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
Space-saving layout
DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type ...
Disco-DFL7362
Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
• Φ300 mm • Stealth Dicing™ • SDBG • SDTT
- DFL7362 is a ...
Disco-DFD6340
Standard dual spindle dicing saw
Φ200 mm Facing dual spindle DBG Package Singulation
Maximized throughput
The DFD6340 features a facing dual-spindle configuration ...
Disco-DFD6361
Advanced performance for Φ300 mm dicing
Φ300 mm Facing dual spindle DBG
Enhanced dicing throughput
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...
Disco-DFD6750
Highly productive dicing saw for precise cutting
Supports other workpiece sizes
Facing dual spindle
Package Singulation
Next generation dicing engine featuring dual chuck tables for ...
Disco-DAD324
Φ6-inch Compact Dicing Saw which Achieves World’s Smallest Footprint while Improving Functionality
Φ150 mm
Single spindle
Support for a variety of applications from semiconductor wafers to ...
Disco-DAD3221
Evolved Compact Dicing Saw
Φ150 mm
Single spindle
Compatible with Diverse Small Workpiece Processing Needs
DAD3221 is a single-axis dicing saw which achieves processing of ...
Disco-DAD3231
Evolved Compact Dicing Saw
Φ150 mm
Single spindle
Focus on Functionality and Expandability
DAD3231, designed for high performance and expandability, just like the conventional ...
Disco-DAD3241
Standard manual dicing saw for Φ8-inch workpieces
Φ200 mm
Single spindle
High processability
Improved throughput through the introduction of servo motors on all axes (X, Y, and ...
Disco-DAD3361
Highly expandability to support various processing needs
Φ300 mm
Single spindle
Supports a wide range of applications
DAD3361 is a semi-automatic dicing saw capable of handling ...
Disco-DAD3431
Adopted an air slide on the X-axis to support high precision processing needs
Φ150 mm
Single spindle
Able to support wide range of applications
Supports workpieces up to Φ6-inch ...
Disco-DAD3651
Ultra-compact Dual Spindle Dicing Saw Which Achieves Increased Processing Stability
Φ200 mm
Facing dual spindle
Small footprint
The optimal design of the DAD3651 combines high ...
Disco-DAD3661
Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm
Facing dual spindle
Package Singulation
Support for workpiece sizes up to 360 × 360 mm
By selecting a ...
Disco-DFG8640
Pursuing high-precision grinding of various workpieces
Φ200 mm
2 axes, 3 chuck tables
DBG
High-precision grinding
High-precision grinding has been required for power devices and ...
Disco-DDS2310
Die separator for small-die wafers
Φ300 mm
SDBG
SDTT
Achieves stable separation for small die after Stealth Dicing™ process
DDS2310 achieves high-quality die separation for ...
Disco-DAW4110
Fine non-thermal curvilinear cutting
Supports other workpiece sizes
Cuts workpieces using pressurized water and abrasives
Through original technology developed to premix and ...
ZHRF Series
Prevents slant and wavy cutting due to increased blade rigidity
Electroformed bond
Applications: Silicon wafer, etc
By employing new technologies, the blade strength is improved compared to ZH05 ...