Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
Semi-automatic surface planer for Φ8-inch wafers
Φ200 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface ...
Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO ...
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO ...
Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm
2 axes, 2 chuck tables
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO ...
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...
Provides stable processing through increased blade edge deformation resistance
Electroformed bond
Applications: Silicon wafer, etc
For relatively thick blades in excess of 60 ...