Standard manual dicing saw for Φ8-inch workpieces Φ200 mm Single spindle High processability Improved throughput through the introduction of servo motors on all axes (X, Y, and ...

Highly expandability to support various processing needs Φ300 mm Single spindle Supports a wide range of applications DAD3361 is a semi-automatic dicing saw capable of handling ...

Adopted an air slide on the X-axis to support high precision processing needs Φ150 mm Single spindle Able to support wide range of applications Supports workpieces up to Φ6-inch ...

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...