Achieves continuous, high-quality processing of oxide wafers
Electroformed bond
Applications: Oxide wafers (LiTaO3, etc.), etc
The ZHFX Series employs a bond that has ideal wear properties for ...
Prevents slant and wavy cutting due to increased blade rigidity
Electroformed bond
Applications: Silicon wafer, etc
By employing new technologies, the blade strength is improved compared to ZH05 ...
Ultrathin hub blades for stable dicing of narrow street wafers
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc
ZHZZ series hub blades were ...