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ZHZZ Series

Back to: Dicing Blades

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Ultrathin hub blades for stable dicing of narrow street wafers

Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc

ZHZZ series hub blades were developed with a focus on narrow street dicing and other processing methods that use thin blades. Adopting the H1 bond, which has high rigidity, reduces blade breakage and wavy cutting for thin kerfs and enables stable processing. The lineup includes a 10 µm wide blade that is the thinnest in the industry, contributing to the drive for narrower streets.

● Reduces blade breakage and wavy cutting for thin kerfs.
● Enables stable processing of narrow streets.
● Ultrathin 10 µm hub blade.



Product Classification

Experimental Data

 

Photographs of Processed Grooves

The ZHZZ series can produce a 10 µm kerf. This is an extremely thin blade compared to 20 to 40 µm blades and has been proven to be able to cut straight grooves

 

Photographs of Processed Grooves

 

  

 

Specification:

Specification

 

 

Precision Processing Tools Process Correlation Chart and Trouble Support

When ordering

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.

 

To use these DISCO blades and wheels (hereafter precision tooling) safely...
Please read carefully and follow the instructions below to prevent any accidents or injuries:

  • USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
  • DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
  • FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
  • DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
  • Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
  • READ the operation manual of the cutting/grinding equipment before use.
  • DO NOT USE the precision tooling with modified or customized equipment.
  • DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
  • DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
  • Always USE water or coolant to prevent precision tooling damage.

 

 

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