Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...

Black-light type UVB-608i UVB-608i is adopted black-light fluorescent lamp and designed minimal specification for exceptional cost-performance value.

Model: UVC-300A for up to 12” UV-LED models which have a long life and low running cost are cassette to cassette fully automatic system and 200mm (8”) manual and 300mm (12”)

Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...