Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond
Applications: Electronics components, Optical devices, Various types of ...
EX Series
Model:
EX-300 for Gr-12
The EX series is an adopted motor drive for expansion stage operation.
Expansion stroke and expansion speed can be controlled numerically.
And film auto-cut function is equipped ...
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond
Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond
Applications: Glass, Quartz, Ceramics, etc
A bond material optimal for the characteristics ...
TEX-218G for up to GR-8
The TEX series is adopted air cylinder for expansion stage operation. It makes
equipment component become simple and realized easy maintenance.
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...