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b1_a
b1
Product Classification

B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
DFG8830
Product Classification

DFG8830

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...
DFM8200
Product Classification

DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...
8761
Product Classification

DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...
DP-F05 Series
Product Classification
DP08
Product Classification

DP08 Series

Chemical-free stress relief dry polishing wheel| In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
Gettering DP
Gettering DP1
Product Classification

Gettering DP

Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
p1a_series
Product Classification

P1A Series

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
z05_2
Product Classification

R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
tm11series
Product Classification

TM11 Series

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
VT07_12SERIES
VT07_12SERIES_1
Product Classification

VT07/12 Series

Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
z05_1
z05_2
Product Classification

Z05 Series

Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
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