Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

Among the world’s smallest fully automatic dicing saws Φ200 mm       Single spindle Factory-friendly design By optimizing the frame structure and handling section layout, the ...

Offering improved productivity of fully automatic dual spindle dicing saws by introducing measures to increase throughput with proven records in the field Φ200 mm   Facing dual ...

Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation A parallel dual design unique to DISCO Featuring parallel dual-spindles, ...

A space-saving solution for Φ300 mm dicing Φ300 mm Facing dual spindle 16% reduced footprint DFD6560 is equipped with uniquely developed short spindles and an optimized ...

High end dicing saw for Φ300 mm wafers Φ300 mm Facing dual spindle Fully automatic dicing saw with dual chuck tables DFD6760 is a high end model which has further enhanced ...

Supports various applications, including full cut and DAF cut Φ300 mm Ablation

• DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...

High-quality, high-throughput standard laser grooving model Φ300 mm Ablation

• DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide ...

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm    Stealth Dicing™   SDBG   SDTT

• DFL7341 is a fully automatic laser saw for Φ8-inch ...