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Blade breakage sensor
Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.
CC Filter Unit
Unique filter design for low filtration running costs
Designed for use next to a dicing saw Ultra-small footprint filtration system
This unit recycles dicing/grinding water and ...
CO 2 Injector
High quality processing through direct link to dicing saw
Workpiece charging significantly reduced
The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
DAL7020
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
DCS1440
Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance
The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DCS1441
Spin cleaning and drying for workpieces processed using dicing saws
Manual cleaning system with enhanced cleaning performance
The DCS1441 is the optimal solution for cleaning and ...
DCS1460
Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance
The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DFL7020
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
DFL7160
Supports various applications, including full cut and DAF cut
Φ300 mm
Ablation
- DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...
DFL7161
High-quality, high-throughput standard laser grooving model
Φ300 mm
Ablation
- DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide ...
DFL7341
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
Φ200 mm Stealth Dicing™ SDBG SDTT
- DFL7341 is a fully automatic laser saw for Φ8-inch ...
DFL7360FH
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
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