Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond
Applications: Electronics components, Optical devices, Various types of ...
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
• Φ300 mm • Stealth Dicing™ • SDBG • SDTT
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond
Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond
Applications: Glass, Quartz, Ceramics, etc
A bond material optimal for the characteristics ...