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super
bubbler
Product Classification

Super Bubbler Wac

Advanced resistivity control technology eliminates electrostatic charge in high-purity water. Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...
staycleanR9
Product Classification

StayClean-R

Conserving Water While Preventing Corrosion Prevents Corrosionby DI water The active component in StayClean-R continuously ...
stayclean-F
Product Classification

StayClean-F

Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
stayclean-A
Product Classification

StayClean-A

Prevents particle adhesion during dicing Cutting water additive to prevent particle adhesion Particle adhesion is a ...
stayclean_injector
Product Classification

StayClean Injector

Dedicated unit for injecting StayClean into cutting water Highly accurate dilution control to ratios as low as 1:10,000. • Automatic bottle replacement enables continuous ...
z05_2
Product Classification

R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
IF_SERIES
Product Classification

Poligrind

Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
p1a_series
Product Classification

P1A Series

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
Noncontact8
Product Classification

Non contact setup

Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.
nbc-zh
Product Classification

NBC-ZH Series

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
IF_SERIES
Product Classification

IF SERIES

High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
mitsui 1
mitsue
Product Classification

ICROS™ Tape

“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...
hogo
hogomax
Product Classification

HogoMax

HogoMax Series Water-soluble protective film for laser processing Highly purified water-soluble protective film for semiconductor processes - HogoMax is a water-soluble resin that prevents particles from ...

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