Products (2) - AUROTECH CORPORATION Disco

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Disco-DFD6750

Highly productive dicing saw for precise cutting Supports other workpiece sizes Facing dual spindle Package Singulation Next generation dicing engine featuring dual chuck tables for ...

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Disco-DFG8640

Pursuing high-precision grinding of various workpieces Φ200 mm 2 axes, 3 chuck tables DBG High-precision grinding High-precision grinding has been required for power devices and ...

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Disco-DFL7362

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si • Φ300 mm • Stealth Dicing™ • SDBG • SDTT
DFL7362 is a ...

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DP-F05 Series

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DP08 Series

Chemical-free stress relief dry polishing wheel| In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...

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DTU1550

Next generation water temperature control unit which has improved cooling efficiency and water supply capacity Stable High Precision Processing DTU1550 is a water supply unit for ...

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DTU162

Higher Dicing quality with lower environmental impact Support for dicing quality The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable ...

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DWR1720

Deionized Water Recycling Unit A super-compact deionized water recycling unit for advanced environmental performance • Integrates deionized water ...

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DWR1722

Ultracompact DI water recycling unit with extraordinary energy and water conservation Numerous functions, ultra compact The DWR1722 is a DI water recycling unit for dicing saws ...

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Gettering DP

Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...

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GF01 SERIES

Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...

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GF13 Series

GRINDING WHEELS Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...

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HogoMax

HogoMax Series Water-soluble protective film for laser processing Highly purified water-soluble protective film for semiconductor processes - HogoMax is a water-soluble resin that prevents particles from ...

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IF SERIES

High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...

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NBC-ZH Series

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...

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Non contact setup

Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.

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P1A Series

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...

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Poligrind

Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...

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R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...

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StayClean Injector

Dedicated unit for injecting StayClean into cutting water Highly accurate dilution control to ratios as low as 1:10,000. • Automatic bottle replacement enables continuous ...