Products (2) - AUROTECH CORPORATION Disco

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StayClean-A

Prevents particle adhesion during dicing Cutting water additive to prevent particle adhesion Particle adhesion is a ...

StayClean-F

Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...

StayClean-R

Conserving Water While Preventing Corrosion Prevents Corrosionby DI water The active component in StayClean-R continuously ...

TM11 Series

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...

UltraPoligrind

Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...

Ultrasonic-wave dicing unit

Realizes high quality and high speed processing of difficult-to-cut materials Targets for ultrasonic-wave processing Ultrasonic-wave processing aims to achieve good processing ...

VT07/12 Series

Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...

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Wheel Guard

Protects wheel segments for streamlined wheel replacement and easier handling.

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Z05 Series

Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...

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Z09 Series

Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...

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ZH05 Series

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...

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ZH14 Series

Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions Electroformed bond Applications: Silicon wafer, Compound ...

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ZHCR Series

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...

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ZHDG Series

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...

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ZHFX Series

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...

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ZHRF Series

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...

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ZHZZ Series

Ultrathin hub blades for stable dicing of narrow street wafers Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc ZHZZ series hub blades were ...

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ZP07 Series

High grade processing is possible with an electroplated porous structure blade
The ZP07 series realizes high-grade processing of hard ...