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DAL7020
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
DFL7020
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
DFL7160
Supports various applications, including full cut and DAF cut
Φ300 mm
Ablation
- DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...
DFL7161
High-quality, high-throughput standard laser grooving model
Φ300 mm
Ablation
- DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide ...
DP08 Series
Chemical-free stress relief dry polishing wheel|
In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
Gettering DP
Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
NBC-ZH Series
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
ZH05 Series
Provides stable processing through high-accuracy concentration control
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14 Series
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...
ZHCR Series
Provides stable processing through increased blade edge deformation resistance
Electroformed bond
Applications: Silicon wafer, etc
For relatively thick blades in excess of 60 ...
ZHDG Series
Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
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