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B1A Series
Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
Metal bond Applications: Electronics components, Optical devices, Various types of ...
ZHFX Series
Achieves continuous, high-quality processing of oxide wafers
Electroformed bond
Applications: Oxide wafers (LiTaO3, etc.), etc
The ZHFX Series employs a bond that has ideal wear properties for ...
ZP07 Series
High grade processing is possible with an electroplated porous structure blade
The ZP07 series realizes high-grade processing of hard ...
The ZP07 series realizes high-grade processing of hard ...
ZHZZ Series
Ultrathin hub blades for stable dicing of narrow street wafers
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc
ZHZZ series hub blades were ...
TM11 Series
Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
ZHDG Series
Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
VT07/12 Series
Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
Z05 Series
Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
The Z05 Series offers ultra-high cutting performance for a wide range of ...
ZH05 Series
Provides stable processing through high-accuracy concentration control
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZHRF Series
Prevents slant and wavy cutting due to increased blade rigidity
Electroformed bond
Applications: Silicon wafer, etc
By employing new technologies, the blade strength is improved compared to ZH05 ...
R07 Series
Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
ZH14 Series
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...
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