fbpx
All Categories
 
Image

Product Filter

Sort by
Sorted product name -/+
Results 1 - 12 of 23
b1_a
b1
Quick View
Product Classification

B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
DP-F05 Series
Quick View
Product Classification

DP-F05 Series


DP08
Quick View
Product Classification

DP08 Series

Chemical-free stress relief dry polishing wheel| In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
FM-22464
Quick View
Product Classification

FM-2246 / 2248 /2243

You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production. This manual wafer mounter series supports three different sizes of ...
3343
Quick View
Product Classification

FM-3343

This wafer mounter is ideal for diversified tape application and lamination conditions. This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
6648
Quick View
Product Classification

FM-6648 / 6643

This model was developed for both pre-cut and normal tape. The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
FM-903S2
Quick View
Product Classification

FM-903S

FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work. Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...
Gettering DP
Gettering DP1
Quick View
Product Classification

Gettering DP

Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
nbc-zh
Quick View
Product Classification

NBC-ZH Series

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
p1a_series
Quick View
Product Classification

P1A Series

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
z05_2
Quick View
Product Classification

R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
tm11series
Quick View
Product Classification

TM11 Series

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
Page 1 of 2

Mobile Menu