fbpx
Image

Product Filter

Sort by
Sorted product name -/+
Results 1 - 11 of 11
DFG8830
Quick View
Product Classification

DFG8830

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...
DFM8200
Quick View
Product Classification

DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...
8761
Quick View
Product Classification

DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...
nbc-zh
Quick View
Product Classification

NBC-ZH Series

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
ZH05SERIES
Quick View
Product Classification

ZH05 Series

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14SERIES
Quick View
Product Classification

ZH14 Series

Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions Electroformed bond Applications: Silicon wafer, Compound ...
zhcrseries
Quick View
Product Classification

ZHCR Series

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...
zhdg1
zhdg2
Quick View
Product Classification

ZHDG Series

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
ZHFX1_SERIES
Quick View
Product Classification

ZHFX Series

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...
ZHRF
Quick View
Product Classification

ZHRF Series

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...
ZHFX1_SERIES
Quick View
Product Classification

ZHZZ Series

Ultrathin hub blades for stable dicing of narrow street wafers Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc ZHZZ series hub blades were ...

Head Office

Clark Office

  • Office Center 06N Bertaphil Clark Center, Jose Abad Santos Avenue, CFZ, 2009 Angeles City, Philippines
  • +639688918656

Baguio Office

  • Lot 14, Block 10, Pinesville Subdivision, Brgy. Kias, Loakan Road, 2600, Baguio City, Philippines
  • +63 (74) 447 3875

Cebu Office

  • Unit 2H BF Mactan Strip II M.L. Quezon Ave., Brgy. Pajo, Lapu-Lapu City 6015, Philippines
  • +63 (32) 2601830

Mobile Menu