Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...

A reinforced plastic double grip rings are consist of inner and outer rings.

You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production. This manual wafer mounter series supports three different sizes of ...