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DFL7361
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
DFL7360FH
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
DFL7560L
Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser
Φ150 mm
Laser Lift-off
- Laser Lift-off is a technology used to detach the material layer from the ...
DAG810
Automatic grinder to respond to new processing needs
Φ200 mm
1 axis, 1 chuck table
Simple and compact single-axis grinder
The DAG810 is a compact, automatic grinder for workpieces ...
DFG8340
Supports small volume grinding with high precisio
Φ200 mm
1 axis, 2 chuck tables
Stable, high-precision wafer processing
With the integration of devices, wafer manufacturing ...
DFG8540
Supports advancements for thinner wafers
Φ200 mm
2 axes, 3 chuck tables
Wafer Thinning
Thin grinding (<100 µm)
Advanced handling systems and design features facilitate high yield ...
DFG8560
Supports advancements for thinner and larger wafers
Φ300 mm
2 axes, 3 chuck tables
DBG
Wafer Thinning
Inherited grinding specifications with an established reputation
DFG8560 is ...
DFG8830
Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
DFP8160
Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...
DFP8140
Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...
DGP8761
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...
DFM2800
Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion ...
DAS8920
Semi-automatic surface planer for Φ8-inch wafers
Φ200 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface ...
DAS8930
Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DFS8910
Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DFS8960
Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DDS2010
High yield and high throughput separation of small die processed with Stealth Dicing™
Φ200 mm
SDTT
Reliable separation of small die wafers
The DDS2010 offers an integrated ...
DDS2300
Die separator for high-precision DAF separation
Φ300 mm
SDBG
SDTT
Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach ...
Cassette and tape frame
High precision products to facilitate stable production from tape mounter
to die bonder. Meets the ø300 mm wafer SEMI standard.
