High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The IF Series in-feed grinding ...
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.
With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond
Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc
Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond
Applications: Glass, Quartz, Ceramics, etc
A bond material optimal for the characteristics ...
Dedicated unit for injecting StayClean into cutting water
Highly accurate dilution control to ratios as low as 1:10,000.
• Automatic bottle replacement enables continuous ...
Prevents pad corrosion during dicingPad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
Advanced resistivity control technology eliminates electrostatic charge in high-purity water.
Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...
TEX-218G for up to GR-8
The TEX series is adopted air cylinder for expansion stage operation. It makes
equipment component become simple and realized easy maintenance.
Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc
UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Realizes high quality and high speed processing of difficult-to-cut materialsTargets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing ...
Model: UVC-300A for up to 12”
UV-LED models which have a long life and low running cost are
cassette to cassette fully automatic system and 200mm (8”) manual
and 300mm (12”)