Highly expandability to support various processing needs Φ300 mm Single spindle Supports a wide range of applications DAD3361 is a semi-automatic dicing saw capable of handling ...

Adopted an air slide on the X-axis to support high precision processing needs Φ150 mm Single spindle Able to support wide range of applications Supports workpieces up to Φ6-inch ...

Ultra-compact Dual Spindle Dicing Saw Which Achieves Increased Processing Stability Φ200 mm Facing dual spindle Small footprint The optimal design of the DAD3651 combines high ...

High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...

Die separator for high-precision DAF separation Φ300 mm SDBG SDTT Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach ...

Die separator for small-die wafers Φ300 mm SDBG SDTT Achieves stable separation for small die after Stealth Dicing™ process DDS2310 achieves high-quality die separation for ...

High precision products to facilitate stable production from tape mounter to die bonder. Meets the ø300 mm wafer SEMI standard.

Protects wheel segments for streamlined wheel replacement and easier handling.

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HogoMax Series Water-soluble protective film for laser processing Highly purified water-soluble protective film for semiconductor processes - HogoMax is a water-soluble resin that prevents particles from ...