Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...

FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work. Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...

This wafer mounter is ideal for diversified tape application and lamination conditions. This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...

High grade processing is possible with an electroplated porous structure blade
The ZP07 series realizes high-grade processing of hard ...